DARPA Condensed an Entire Communications System Into This Dime-Sized Chip

DARPA may have found the next stage for miniaturizing communications systems in a way that will make even the current slim systems look as bulky and outdated as the giant computers of the 1950's look to us today. DARPA has created a tiny, all silicon radio transmitter chip that, while lighter and and less-expensive, is actually more powerful than the current gallium-arsenide standard.

The new chips are part of DARPA’s ELASTx (Efficient Linearized All-Silicon Transmitter ICs) program. The idea is to create better communications hardware for radio systems, radar and computerized guidance system. Now for the first time, a silicon only system on a chip can perform at and above the standard needed for military and other communications systems.

"What normally would require multiple circuit boards, separate metal shielded assemblies and numerous I/O cables we can now miniaturize onto one silicon chip about half the size of an adult’s thumbnail," said Dev Palmer, DARPA program manager in a release. "This accomplishment opens the door for co-designing digital CMOS [complementary metal oxide semiconductors] and millimeter-wave capabilities as an integrated system on an all-silicon chip, which should also make possible new design architectures for future military RF systems."

Understated enthusiasm aside, the chip is a good example of big changes coming out of small packages. As Palmer mentioned, new design architectures are possible with the new chip, and that means longer-range communication of more information between computer systems and less hardware needed to make it happen. It can also multitask, communicating with different kinds of systems all at once without needing to switch between chips. DARPA is working with local defense contractor Northrop Grumman Aerospace Systems to develop the chips, which will now move through further developments and prototypes, but could be standard military and even civilian equipment in the not too distant future.

"Its efficient silicon construction will significantly reduce SWAP [size, weight, and power] requirements for millimeter-wave applications, including compact satellite communications ground terminals for frontline troops," Palmer said. " These new capabilities will provide connectivity to more service members faster and at lower cost."

Image via DARPA

FILED UNDER:
DARPA, DC Tech, Defense

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